WINPAC Inc. produces and sells semiconductor packaging and testing solutions in South Korea. Its packaging products comprise fine pitch ball grid array typed packages for flash/SRAM/fast SRAM, flash/SRAM MCP/DRAM, and ASIC/logic/analog IC packaging; land grid array type packages for PC, memory, DDR2, graphic memory, and mobile phone packaging; and POP and flip chip package products. The company’s packaging products also include quad flat packages for analog, ASIC, DSP, PLD, sensor, and micro-controller packaging; quad flat no lead packages for analog, ASIC, wireless RF, MEMS, cell phone, and laptop packaging; humidity sensor packages for automotive, home appliance, industrial HVAC, smart home products, and washing machine packaging; and proximity/ambient light sensor packages for smart phone, automotive, and home appliance, as well as smart, lighting, and display devices packaging. In addition, it offers USB flash drives for portable storage applications; and solid state drives for PC, mobile phone, and digital camera storage applications. Further, the company provides design and simulation services, as well as semiconductor testing services, including SOC and memory testing. WINPAC Inc. was founded in 2002 and is based in Yongin-si, South Korea.